Wafer Inspection Scheme Shenzhen SPOTECK Technology Co., Ltd., SPOTECK has been focusing on machine vision inspection for 13 years.
There are a lot of testing cases, wide application areas, free sampling, development of testing programs, rapid outbound.
1. Contents and requirements of testing
Measure workpiece area:
Appearance and Dimension Detection of Samples 1.44mm in Length, 1.43mm in Width and 1.65mm in Height
Detection Contents: Damage, cracks, stomata, poor nickel layer
1: Bottom Positive Detection Appearance
2: Side Positive Detection Appearance
3: Side Positive Detection Appearance
4: Side Positive Detection Appearance
5: Side Positive Detection Appearance
6: Top Positive Detection Appearance
Note: The above detection items need to be clearly visible under the image to detect.
Detection efficiency: 250-350 pieces per minute (according to sample feeding speed).
Division of work: Subdivide the detection steps according to the detection content.
II. Equipment Composition and Major Institutions
Overall Composition: Dimension: 900*800*1850 mm
Model: SP_T300
1:SPOTECK Visual Detection Software
2: industrial computer
3: display 19 inches
4: Industrial cameras: 6 sets, 1 bottom, 4 side and 1 top.
5: Industrial Lens: 6 FA Industrial Lens
6: professional glass tray
7: solenoid valve
8: reducer
9: vibration cabinet
10: Feeding Equipment (Vibrating Disk, Direct Vibration, Controller)
II.1: 3-D Stereogram of Equipment Appearance
3:1 Bottom Positive Detection Method
Bottom Test Fine Product Analysis Chart: OK
3:1 Bottom Positive Detection Method
Bottom defective product analysis chart (fission): NG
3:1 Bottom Positive Detection Method
Bottom defective product analysis chart (bad nickel layer): NG
3:2 Side Positive Light Detection Method
Analysis Chart of Fine Products for Side Detection: OK
3:2 Side Positive Light Detection Method
Side detection defective product analysis chart (breakage): NG
3:2 Side Positive Light Detection Method
Top defective product analysis chart (stomata): NG
3:3 Side Positive Light Detection Method
Analysis Chart of Fine Products for Side Detection: OK
3:3 Side Positive Light Detection Method
Side detection defective product analysis chart (breakage): NG
3:3 Side Positive Light Detection Method
Top defective product analysis chart (stomata): NG
IV. System Installation Requirements:
Inspection space for equipment placement: Separately installing SP visual inspection system at the pipeline side, it is necessary to ensure that there is enough space to install the equipment.
Ambient temperature: 0-50 degrees Celsius;
Air humidity: below 90% RH;
Electronic jamming: Provide equipment with less electronic jamming.
Power supply: 220V, 50Hz AC, less than 1KVA power consumption, air pressure 0.35-0.7MPa
Above is the wafer detection scheme, the main contents of detection are breakage, cracks, pore, poor nickel layer and size.
Artile Original From:https://www.sipotek.net/wafer-inspection-scheme/
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